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Spin Coater

Spin coater is used to deposit uniform thin films to flat substrates. Usually a small amount of coating material is applied on the center of the substrate. The substrate is then rotated at high speed in order to spread the coating material by centrifugal force until the desired thickness of the film is achieved.


  • Uniform thin film deposition on flat substrates
  • Microfabrication of oxide layers
  • Photolithography
  • MEMS production

Special Features

  • Online display of speed profile on screen
  • The ability to develop 8 speed steps with the control over each step’s slope
  • The ability to save/restore/modify 6 programs
  • Low vibration and noise intensity

Technical Specifications

  • Voltage: 220 V (AC)
  • Rotation speed: up to 5000 rpm
  • Wafer holder with high precision
  • Vacuum pump capacity: 32 L/min
  • Vacuum input: 400-630 mmHg
  • Drain output: Silicon rubber tube